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          PCB PCB Common Fault Dialysis
          Scan: Date:2018-06-13
          PCB, commonly known as printed circuit board, is an indispensable part of electronic components and plays a central role. In a series of PCB production processes, there are many matching points. If you do not care, there will be flaws in the board, and the whole body will be affected. The quality problems of the PCB will be endless. Therefore, after the circuit board is made and molded, the inspection test becomes an indispensable step. Below to share with you the PCB circuit board failure and its solutions.

          1, the PCB board often occurs in the use of stratification

            
          Reasons: (1) Supplier material or process issues

                      
          (2) The design material and copper surface are not well distributed

                      
          (3) The storage time is too long, exceeds the storage period, PCB board moisture

                      
          (4) Improper packing or preservation, dampness

            
          Response measures: Select the packaging, use constant temperature and humidity equipment for storage. Do a good job of PCB factory reliability test, such as: thermal stress test test in PCB reliability test, responsible for the supplier is to take more than five non-stratification as a standard, in the sample stage and mass production cycle will be confirmed, The average vendor may only request 2 times and it will be confirmed once in a few months. The IR test of analog placement can also prevent the outflow of defective products, which is a must for excellent PCB manufacturers. In addition, PCB plate Tg should be selected at 145 °C or more, so that it is relatively safe.

            
          Reliability test equipment: constant temperature and humidity box, stress screening type thermal shock test box, PCB reliability test equipment

          2, bad soldering PCB board

            
          Causes: Long time of storage, moisture absorption, layout contamination, oxidation, abnormal black nickel, anti-welding SCUM (shadow), anti-welded PAD.

            
          Remedy: When purchasing, pay close attention to the quality control plan of the PCB factory and the standards set for maintenance. For example, black nickel, need to see whether the PCB board production plant has outgoings, whether the chemical concentration of the chemical line is stable, whether the analysis frequency is sufficient, whether periodical stripping test and phosphorus content test are set to test, and whether the internal solderability test is There is good execution and so on.

          3, PCB bending plate bending

            
          Reasons: The supplier's material selection is unreasonable, the heavy industry has a bad control, the storage is improper, the operation line is abnormal, the copper area difference of each layer is obvious, and the broken hole production is not firm enough.

            
          Responsive measures: After the sheet is pressurized with wooden pulp, it is packaged and shipped to avoid deformation later. If necessary, add jigs on the patch to prevent the device from excessively bending the board. The PCB needs to simulate the conditions of mounting IR before packaging, so as to avoid the phenomenon of board bending after passing through the furnace.

          4, bad PCB board impedance

            
          Cause: The impedance difference between PCB lots is large.

            
          Responsive measures: The manufacturer is required to attach a batch test report and an impedance strip when delivering the product, and if necessary, provide the comparison data of the inner diameter and the edge diameter of the board.

          5, anti-welding blistering / shedding

            
          Reasons: There are differences in the selection of solder resist inks, abnormalities in the solder mask protection process of the PCB board, and heavy work or patch temperatures.

            
          Responsive measures: PCB suppliers need to develop PCB board reliability test requirements and control them in different production processes.

          6, the Fanfani effect

            
          Reason: The electrons will dissolve into copper ions in the process flow of OSP and Daikin noodles, resulting in a difference in potential between gold and copper.

            
          Response: The manufacturer is required to pay close attention to the control of the potential difference between gold and copper during the production process.
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